Semiconductor memory device including page latch circuit

ABSTRACT

A semiconductor memory device having a data latch circuit has plural bit lines to which a reprogrammable memory cell is connected, a data bus on which data is transferred, a latch circuit latching the data transferred on the data bus, a read out circuit connected to the data bus, and a data transfer circuit group to directly transfer the data latched in the latch circuit to the read out circuit without transferring it to the memory cell.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a continuation-in-part of U.S. applicationSer. No. 09/794,076, filed Feb. 28, 2001, the entire contents of whichare incorporated herein by reference.

[0002] This application is based upon and claims the benefit of priorityfrom the prior Japanese Patent Application No. 2000-066954, filed Mar.10, 2000, the entire contents of which are incorporated herein byreference.

BACKGROUND OF THE INVENTION

[0003] 1. Field of the Invention

[0004] This present invention relates to a semiconductor memory devicewhich is reprogrammable, and particularly relates to a reprogrammablesemiconductor memory device having a page latch.

[0005] 2. Related Art

[0006] In some of a nonvolatile semiconductor memory device (EEPROM)which is reprogrammable by one byte to by a few tens bytes (for onepage), one latch circuit (page latch circuit) for retaining one pagedata is provided for every bit line. In this specification, thenonvolatile semiconductor memory device is called a semiconductor memorydevice having a page latch.

[0007] An operation of a conventional nonvolatile semiconductor memorydevice having a page latch will be explained. FIGS. 18a to 18 c indicatedata flow diagrams at a data loading operation, at a programmingoperation and at a read operation in a conventional semiconductor memorydevice having a page latch, respectively. First of all, as shown in FIG.18a, one-page program data are loaded to a page latch. When one-pageprogram data are stored in the page latch, typically one page datastored in memory cells are erased.

[0008] As shown in FIG. 18b, the one-page program data in the page latchare simultaneously written to the one-page memory cells, whose previousdata have been erased. Also, when a data in the memory cell is read out,as shown in FIG. 18c, a selected memory cell is connected to a read outcircuit and the data is read from the selected memory cell.

[0009] However, once a data loading operation is started, the operationcontinues to a data erasing operation and a data programming operationautomatically in the conventional nonvolatile semiconductor memorydevice with a page lath. Also, in the data reading out operation, theconventional nonvolatile semiconductor memory device only has a mode inwhich the operation reads out data programmed to the memory cell.

[0010] In such conventional nonvolatile memory devices with pagelatches, when a data is programmed to a memory cell and the programmeddata is read out from the memory cell, and assuming that the data whichis read out includes an error, it is very hard to determine whether thedata which is programmed to the memory cell has included the error orthe data which is read out from the memory cell was broken at the readout circuit.

[0011] Also, when you test the page latch and the read out circuit inthe conventional nonvolatile semiconductor memory device, you need avery long time to test because a data is programmed to a memory cellautomatically.

SUMMARY OF THE INVENTION

[0012] An object of this invention is to provide a semiconductor memorydevice capable of making it easy to determine a cause of an error ifthere is an error in reprogrammed data and carrying out a test of thepage latches and the read out circuits in a short time.

[0013] In order to accomplish the above object of this invention, asemiconductor memory device related to this invention comprises a bitline to which a reprogrammable memory cell is connected, a data bus onwhich data is transferred, a latch circuit having latching the datatransferred on the data bus, a read out circuit connected to the databus and a data transfer circuit group has an ability to directlytransfer the data latched in the latch circuit, to the read out circuitwithout via the memory cell.

[0014] The data transfer circuit may have a first operation mode totransfer a data loaded to the latch circuit, to the memory cellconnected to the bit line, a second operation mode to a data read outfrom the memory cell to the read circuit and a third operation mode todirectly transfer the data latched in the latch circuit, to the readcircuit.

[0015] The third operation mode may be performed during a test of thesemiconductor memory device.

[0016] The first and the second operation mode may be performed during anormal operation and the third operation mode is performed during a testof the semiconductor memory device.

[0017] The data transfer circuit group may have a first transfer gate,an one end of which electrically connected to the bit line, a secondtransfer gate, an one end of which electrically connected to an otherend of the first transfer gate, a third transfer gate, an one end ofwhich electrically connected to the one end of the first transfer gateand an other end of which electrically connected to the latch circuitand a fourth transfer gate, an one end of which electrically connectedto an other end of the second transfer gate and an other end of whichelectrically connected to the read out circuit.

[0018] It is desirable that when a data loaded to the latch circuit istransferred to the memory cell, the first transfer gate is set to ONstate, the second transfer gate is set to OFF state, the third transfergate is set to ON state, the fourth transfer gate is set to ON state,when a data read out from the memory cell is transferred to the read outcircuit, the first transfer gate is set to ON state, the second transfergate is set to ON state, the third transfer gate is set to OFF state,the fourth transfer gate is set to ON state, when a data loaded to thelatch circuit is directly transferred to the read out circuit withoutvia the memory cell, the first transfer gate is set to OFF state, thesecond transfer gate is set to ON state, the third transfer gate is setto ON state, the fourth transfer gate is set to ON state.

[0019] A voltage of a gate electrode of the third transfer gate may begradually raised to set to ON state.

[0020] It may be desirable that when a data loaded to the latch circuitis transferred to the memory cell, the first transfer gate is set to ONstate, the second transfer gate is set to OFF state, the third transfergate is set to ON state, the fourth transfer gate is set to OFF state,when a data read out from the memory cell is transferred to the read outcircuit, the first transfer gate is set to ON state, the second transfergate is set to ON state, the third transfer gate is set to OFF state,the fourth transfer gate is set to ON state, when a data loaded to thelatch circuit is transferred to the read out circuit, the first to thefourth transfer gate are set to ON state, the memory cell is set tonon-selected state.

[0021] A voltage of a gate electrode of the third transfer gate may begradually raised to set to ON state.

[0022] The semiconductor memory device having a data latch circuitfurther comprises a control circuit controlling the transfer gate groupso as to achieve a first and second operation modes, the first operationmode programming a data loaded to the latch circuit, to the memory cell,the second operation mode stopping an operation after a data is loadedto the latch circuit.

[0023] The first operation mode may be performed at a normal operation,the second operation mode is performed at a testing operation.

[0024] The semiconductor memory device having a data latch circuitfurther comprises an error correction circuit is electrically connectedto the read out circuit.

[0025] A semiconductor memory device having a data latch circuitcomprise, a bit line to which a reprogrammable memory cell is connected,a data bus on which data is transferred, a latch circuit having latchingthe data transferred on the data bus, a read out circuit connected tothe data bus and a data transfer circuit group, wherein the datatransfer circuit group is controlled so as to transfer the data latchedin the latch circuit, to the read out circuit without via the memorycell.

[0026] The data transfer circuit may have a first operation mode totransfer a data loaded to the latch circuit, to the memory cellconnected to the bit line, a second operation mode to a data read outfrom the memory cell to the read circuit and a third operation mode todirectly transfer the data latched in the latch circuit, to the readcircuit.

[0027] The third operation mode may be performed during a test of thesemiconductor memory device.

[0028] The first and the second operation mode may be performed during anormal operation and the third operation mode may be performed during atest of the semiconductor memory device.

[0029] It is desirable that the data transfer circuit group has a firsttransfer gate, an one end of which electrically connected to the bitline, a second transfer gate, an one end of which electrically connectedto an other end of the first transfer gate, a third transfer gate, anone end of which electrically connected to the one end of the firsttransfer gate and an other end of which electrically connected to thelatch circuit and a fourth transfer gate, an one end of whichelectrically connected to an other end of the second transfer gate andan other end of which electrically connected to the read out circuit.

[0030] It is desirable that when a data loaded to the latch circuit istransferred to the memory cell, the first transfer gate is set to ONstate, the second transfer gate is set to OFF state, the third transfergate is set to ON state, the fourth transfer gate is set to ON state,when a data read out from the memory cell is transferred to the read outcircuit, the first transfer gate is set to ON state, the second transfergate is set to ON state, the third transfer gate is set to OFF state,the fourth transfer gate is set to ON state, when a data loaded to thelatch circuit is directly transferred to the read out circuit withoutvia the memory cell, the first transfer gate is set to OFF state, thesecond transfer gate is set to ON state, the third transfer gate is setto ON state, the fourth transfer gate is set to ON state.

[0031] A voltage of a gate electrode of the third transfer gate may begradually raised to set to ON state.

[0032] It may be desirable that when a data loaded to the latch circuitis transferred to the memory cell, the first transfer gate is set to ONstate, the second transfer gate is set to OFF state, the third transfergate is set to ON state, the fourth transfer gate is set to OFF state,when a data read out from the memory cell is transferred to the read outcircuit, the first transfer gate is set to ON state, the second transfergate is set to ON state, the third transfer gate is set to OFF state,the fourth transfer gate is set to ON state, when a data loaded to thelatch circuit is transferred to the read out circuit, the first to thefourth transfer gate are set to ON state, the memory cell is set tonon-selected state.

[0033] A voltage of a gate electrode of the third transfer gate may begradually raised to set to ON state.

[0034] The semiconductor memory device having a data latch circuitfurther comprises a control circuit controlling the transfer gate groupso as to achieve a first and second operation modes, the first operationmode programming a data loaded to the latch circuit, to the memory cell,the second operation mode stopping an operation after a data is loadedto the latch circuit.

[0035] The first operation mode may be performed at a normal operation,the second operation mode is performed at a testing operation.

[0036] The semiconductor memory device having a data latch circuitfurther comprises an error correction circuit is electrically connectedto the read out circuit.

[0037] A test method of a semiconductor memory device comprises stepsof; latching data at a page latch via a data bus on which the data aretransferred, transferring the data latched in the page latch to a cellmatrix for stored the data at a first mode and to a read out circuit ata second mode for testing whether or not an error occurs at a datatransfer circuit group including the data bus, the page latch and readout circuit.

BRIEF DESCRIPTION OF THE DRAWINGS

[0038]FIG. 1a and FIG. 1b show data flows respectively in a case that asemiconductor memory device of a first embodiment of this invention isset for a data loading operation and a page latch reading out operation.

[0039]FIG. 2 shows a circuit example of a page latch which is providedin the semiconductor memory device of the first embodiment of thisinvention.

[0040]FIG. 3 shows a waveform diagram which indicates a data loadingoperation of the page latch in FIG. 2.

[0041]FIG. 4 shows a waveform diagram which indicates a programmingoperation of the page latch in FIG. 2.

[0042]FIG. 5 shows a waveform diagram which indicates a reading outoperation of the page latch in FIG. 2.

[0043]FIG. 6 shows a waveform diagram which indicates a page latchreading out operation of the page latch in FIG. 2.

[0044]FIG. 7a shows a state of the page latch at a data loadingoperation. FIG. 7b shows a state of the page latch at a programmingoperation. FIG. 7c shows a state of the page latch at reading outoperation. FIG. 7d shows a state of the page latch at a page latchreading out operation.

[0045]FIG. 8a and FIG. 8b show a circuit diagram of a control circuit tocontrol a transfer signal N2.

[0046]FIG. 9 shows a waveform diagram which indicates another page latchreading out operation of a page latch in FIG. 2.

[0047]FIG. 10a shows a circuit diagram of a NOR type nonvolatilesemiconductor memory device. FIG. 10b shows a circuit diagram of athree-transistor type nonvolatile semiconductor memory device.

[0048]FIG. 11 shows a block diagram of one example of the controlcircuit.

[0049]FIG. 12 shows a waveform diagram, which indicates a normaloperation of the control circuit in FIG. 11.

[0050]FIG. 13 shows a waveform diagram which indicates a normaloperation of the control circuit in FIG. 11.

[0051]FIG. 14 shows a waveform diagram which indicates a testingoperation of the control circuit in FIG. 11.

[0052]FIG. 15 shows a flow chart which indicates a control sequence ofthe control circuit.

[0053]FIG. 16a and FIG. 16b show data flows respectively in a case thata semiconductor memory device of a second embodiment of this inventionis set for a data loading operation and a page latch reading outoperation.

[0054]FIG. 17a to FIG. 17c show data flows at the data loading operationand the page latch reading out operation of the second embodiment ofthis invention respectively.

[0055]FIG. 18a to FIG. 18c show data flows at the data loadingoperation, the data programming operation and the data reading outoperation of the conventional semiconductor memory device respectively.

[0056]FIGS. 19 and 20 show examples of a memory card.

[0057]FIG. 21 shows an example of a card holder.

[0058]FIGS. 22 and 23 show examples of application of the invention

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0059] Embodiments of the invention are explained with reference tofigures, in which same numbers refer to same parts throughout thefigures.

[0060] FIRST EMBODIMENT.

[0061]FIGS. 1a and 1 b show data flows at a data loading operation andat a data reading out operation from a page latch (page latch read) of anonvolatile semiconductor memory device of a first embodiment,respectively. As shown in FIG. 1a, one page data are loaded to a pagelatch 11 via a data bus 1 at the data loading operation. Then, theconventional nonvolatile semiconductor memory device, erasing of dataprogrammed in a memory cell and programming of the loaded data followthe loading operation continuously and automatically when program dataof one page are set to the page latch 11.

[0062] On the other hand, in the nonvolatile semiconductor memory deviceof the first embodiment of this invention, the loading operation is oncestopped when program data of one page are set to the page latch 11.

[0063] After the stop of the operation, as shown in FIG. 1b, the pagelatch 11 is electrically separated from a cell matrix 2 and,furthermore, is electrically connected to a read out circuit 27.Thereby, the data loaded to the page latch 11 can be transferred to theread out circuit 27 directly and read out form the page latch 11 withouttransferring the data to the cell matrix 2.

[0064] The reading out operation, which reads out the data from the pagelatch 11, for instance, is carried out at a testing operation. Thereading out operation can be used for an examination for separatingnon-defect productions from defect productions and for a defect analysisof nonvolatile semiconductor memory device, or the like.

[0065] The nonvolatile semiconductor memory device of the firstembodiment in this present invention can carry out operations shown inFIG. 18a to FIG. 18c at a normal operation. In other words, thenonvolatile semiconductor memory device of the first embodiment in thispresent invention can be used, similarly to the conventional nonvolatilesemiconductor memory device at the normal mode.

[0066] Next, one circuit example of the page latch 11 is described. FIG.2 shows an exemplary circuit diagram of the page latch 11 contained inthe nonvolatile semiconductor memory device of the first embodiment.

[0067] As shown in FIG. 2, the page latch 11 has first transfer gates13-1 to 13-N, second transfer gates 15-1 to 15-N, third transfer gates17-1 to 17-N and latch circuits 19-1 to 19-N, respectively. The first tothird transfer gates comprise, for instance, MOS transistors.

[0068] Each one end of current paths of the fist transfer gates 13-1 to13-N is connected to corresponding bit lines BL1 to BLN respectively. Atransfer signal N3 is commonly supplied to control nodes of the firsttransfer gate 13-1 to 13-N.

[0069] Each one end of current paths of the second transfer gates 15-1to 15-N is connected to corresponding ends of the current paths of thefirst transfer gates 13-1 to 13-N respectively, which are connected to adata line 21. The data line 21 is one line of the data bus 1 shown inFIGS. 1a and 1 b. The data line 21 is connected to the read out circuit27 via a fourth transfer gate 25. A transfer signal N4 is supplied to acontrol node of the fourth transfer gate 25. Select transfer signalsN1[1] to N1[N] are supplied to the control nodes of the second transfergates 15-1 to 15-N respectively. The select transfer signals N1[1] toN1[N] are column select signals and outputted from a decoder 3 (a columndecoder) shown in FIG. 1a and FIG. 1b.

[0070] Each one end of current paths of the third transfer gates 17-1 to17-N is connected to corresponding nodes 23-1 to 23-N respectively. Eachof the nodes 23-1 to 23-N is the corresponding connection-node betweenthe first transfer gates 13-1 to 13-N and the second transfer gates 15-1to 15-N respectively. Each another end of current paths of the thirdtransfer gates 17-1 to 17-N is connected to corresponding latch circuits19-1 to 19-N respectively. A transfer signal N2 is supplied to thecontrol nodes of the third transfer gates 17-1 to 17-N commonly.

[0071] In the above-stated circuit, each gate of the first transfergates 13-1 to 13-N, the second transfer gates 15-1 to 15-N, the thirdtransfer gates 17-1 to 17-N and the fourth transfer gates 25 functionsas a data transfer circuit for transferring data. The data transfercircuit transfers data inputted on the data line 21 to the memory cellvia the latch circuits 19-1 to 19-N and the bit lines BL1 to BLN, ortransfers data via the data line 21 to the read out circuit 27.

[0072] In the page latch 11 shown in FIG. 2 the N latch circuits 19-1 to19-N are electrically connected to one data line 21. Therefore, at thedata loading, data are loaded to the page latch 11 N times. When a totalof N data are latched to the latch circuits 19-1 to 19-N, respectively,one page data are set to the page latch 19. After that, as shown in FIG.1b, the page latch reading out operation or the data erasing and thedata programming operations are carried out.

[0073] The number of the latch circuits 19-1 to 19-N provided in thepage latch 11 shown in FIG. 2 may be M (an integral number) in an actualdevice. In this case, parallel data M×N (M parallel data, N times) areloaded to the M page latches 11 via the M data lines 21. When a total ofM×N data are latched to the corresponding M×N latch circuitsrespectively, one page data is set in the page latches 11. After that,as shown in FIG. 1b, the page latch reading out operation, or the dataerasing and the data programming operations are carried out. Next, anexample of operation of page latch 11 (FIG. 2) is described.

[0074] Data Loading Operation.

[0075]FIG. 3 shows waveform diagram s at the data loading operation ofthe data latch 11 shown in FIG. 2. Also, FIG. 7a shows states of thepage latch II at the data loading operation.

[0076] As shown in FIG. 3, at a time t1, a chip enable signal /CE and awrite enable signal /WE are set from High level to Low levelrespectively. When each of the chip enable signal /CE and the writeenable signal /WE is set to Low level, the transfer signals N3 and N4are set from High level to Low level respectively.

[0077] As a result, the first transfer gates 13-1 to 13-N and the fourthtransfer gate 25 are set to OFF respectively, the page latch 11 iselectrically separated from the cell matrix 2 and the read out circuit27. When the chip enable signal /CE and the write enable signal /WE areset to Low level, an address signal ADD is inputted to the chip. As aresult, typically one of the N select transfer signals N1[1] to N1[N] isselected in accordance with the inputted address signal ADD, and theselected signal (for example, the select transfer gate signal N1[1]) isset from Low level to High level. This causes the second transfer gate15-1 to turn ON, and the data DATA is transferred from the data line 21to the connection node 23-1.

[0078] Next, at a time t2, a transfer signal N2 is set to High level,thereby forcing the third transfer gates 17-1 to 17-N to turn ONrespectively. As a result, as shown in FIG. 7a, the data DATA istransferred to the latch circuit 19-1 from the data line 21 via theconnection node 23-1, and latched by the latch circuit 19-1.

[0079] Same operations are repeated from times t3 to t8. Thereby, thedata DATA are transferred to all of the latch circuits 19-1 to 19-N andthe N data are latched to the corresponding latch circuits 19-1 to 19-Nrespectively. And at a time t9, a DATA LOAD END signal is set to Highlevel contemporarily, thereby finishing the data loading operation.

[0080] Programming Operation.

[0081] The programming operation is carried out after the erasingoperation. FIG. 4 shows waveform diagrams of the programming operationof the page latch 11 illustrated in FIG. 2. FIG. 7a shows a diagramillustrating a state of the page latch 11 at the programming operation.As shown in FIG. 4, first of all, at a time t1, a signal ERASE ENDindicated to an end of the erasing operation is set to High level to Lowlevel. Thereby, all of the select transfer signals N1[1] to N1[N] areset to Low level. And the transfer signal N3 remains at High level.

[0082] As a result, the page latch 11 is electrically connected to thecell matrix 2 and separated from the data line 21. Also, the transfersignal 2 slowly changes from at Low level to High level in order toprevent the data from destruction by a charge sharing. This, as shown inFIG. 7b, allows each of the data DATA latched in the latch circuits 19-1to 19-N to be slowly transferred to the bit lines BL1 to BLN and to beprogrammed to the memory cells (not shown in FIG. 7a) connected to bitlines BL1 to BLN respectively. Next, at a time t2, the transfer signalN2 is set from High level to Low level. The PROGRAM END signal is set toHigh level contemporarily and the programming operation is finished.

[0083]FIG. 8a and FIG. 8b show circuit examples of the control circuitsto control the transfer signal N2 (hereafter, which are called N2control circuits). As shown in FIGS. 8a and 8 b, transfer signals N2SLOW and N2 QUICK are inputted to the N2 control circuit 100. At thedata loading operation, the transfer signal N2 QUICK is set to Lowlevel. Thereby, a output node 102 is sharply charged from a voltagesupply VCC via a transistor PMOS 101. On the other hand, at theprogramming operation or the after-stated page latch reading outoperation, the transfer signal N2 SLOW is set to Low level. Thereby, theoutput node 102 is slowly charged from the voltage supply VCC via adepletion type NMOS 104 and a PMOS resistor 103 or resistance 105. Theseallow the transfer signal N2 to be slowly changed from Low level to Highlevel.

[0084] In order to prevent the data from destruction by the chargesharing, an inverter circuit can be located between the latch circuits19-1 to 19-N and the third transfer gates 17-1 to 17-N, other than thetransfer signal N2 being made to change slowly from Low level to Highlevel. But in view of high integration, it is more preferable that thetransfer signal N2 is made to change slowly from Low level to High levelthan that the inverter circuit is located between the latch circuits19-1 to 19-N and the third transfer gates 17-1 to 17-N.

[0085] Reading Out Operation.

[0086] As shown in FIG. 5, first of all, at a time t1, each of the chipenable signal /CE and the output enable signal /OE are set from Highlevel to Low level, thereby allowing the signal N4 to be set from Lowlevel to High level. Also, the signal N3 remains at High level and thesignal N2 remains at Low level.

[0087] As a result, the page latch 11 is electrically connected to thecell matrix 2 and the data line 21 is electrically connected to the readout circuit 27 (see FIG. 2). This allows data DATA stored in the memorycell to be transferred to the connection nodes 23-1 to 23-N via the bitlines BL1 to BLN. After that, when the chip enable signal /CE and theoutput enable signal /OE are set to Low level respectively, the addresssignal ADD is inputted to the chip. As a result, by the address signalADD, one of the N select transfer signals N1[1] to N1[N] is selectedtypically, and the selected one of the select transfer signals is setfrom Low level to High level. Thereby, as shown in FIG. 7c, a selectedone of the bit lines BL1 to BLN (for example, BL1 in FIG. 7c) isconnected to the data line 21 via the connection node 23-1, and the dataDATA stored in the memory cell is transferred to the read out circuit27, and the data DATA which is transferred to the read out circuit 27 isoutputted from the read out circuit 27 as a read out data.

[0088] Next, at a time t2, the chip enable signal /CE and the outputenable signal /OE are set from Low level to High level respectively.Thereby the transfer signal N4 is set from High level to Low level, andthe reading out operation is over.

[0089] Page Latch Reading Operation.

[0090]FIG. 6 shows a waveform diagram which indicates a page latchreading out operation illustrated in FIG. 2. And FIG. 7d shows a statediagram of the page latch 11 at the page latch reading out operation.

[0091] As shown in FIG. 6, first of all, at a time t1, similar to thereading out operation, the chip enables signal /CE and the output enablesignal /OE are set from High level to Low level respectively. Thereby,at the page latch reading out operation, the signal N4 is set from Lowlevel to High level, and the signal N3 is set from High level to Lowlevel.

[0092] As a result, the first transfer gates 13-1 to 13-N turn OFF, thepage latch 11 is electrically separated from the cell matrix 2. Also,the fourth transfer gate 25 turns ON. The data line 21 is electricallyconnected to the read out circuit 27. Furthermore, the signal N2 slowlychanges from at Low level to High level. This allows data latched in thelatch circuit 19-1 to 19-N to be slowly transferred to the connectionnodes 23-1 to 23-N. After that, similar to the reading out operation,when the chip enable signal /CE and the output enable signal /OE are setto Low level respectively, the address signal ADD is inputted into thechip. Thereby, by the address signal ADD, one of the N select transfersignals N1[1] to N1[N] is selected typically, and the selected one ofthe select transfer signals is set from Low level to High level. As aresult, as shown in FIG. 7d, a selected one of the latch circuits 19-1to 19-N (for example, a latch circuit 19-1 in FIG. 7c) is connected tothe data line 21 via the connection node 23-1, and the data DATA latchedin the memory cell is transferred to the read out circuit 27, and thedata DATA which transferred to the read out circuit 27 is outputted fromthe read out circuit 27 as a read out data.

[0093] Next, at a time t2, the chip enable signal /CE and the outputenable signal /OE are set from Low level to High level respectively.Thereby the transfer signal N3 is set from Low level to High level, andthe signal N2 and N4 are set from High level to Low level respectively,then the page latch reading out operation is over.

[0094] Another type of the page latch reading out operation is nowdescribed. The page latch reading out operation which is explained withreference to FIG. 6 and FIG. 7 is carried out at the state where thefirst transfer gates 13-1 to 13-N are set to be OFF and the page latch11 is electrically separated from the cell matrix 2. However, the pagelatch reading out operation also may be carried out at a state where thepage latch 11 is electrically connected to the cell matrix 2.Hereinafter, another type of the page latch reading out operation isdescribed.

[0095]FIG. 9 shows a waveform diagram of another page latch reading outoperation of the page latch 11 illustrated in FIG. 2. Also, FIG. 10ashows a state diagram of the page latch 11 at this another type of thepage reading out operation. As shown in FIG. 9 and FIG. 10, this anothertype of the page latch reading out operation differs from the page latchreading out operation which is explained with reference to FIG. 6 andFIG. 7d, in the viewpoint that the memory cell is set to be non-selectedstate, while in the latter type of the latch reading out operation thesignal N3 remains at High level and the first transfer gates 13-1 to13-N are ON.

[0096] With the memory cell MC being at non-selected state, even if thefirst transfer gates 13-1 to 13-N are at ON state, the data stored inthe memory cell is not transferred to the bit lines BL1 to BLN.Therefore, the data latched in the latch circuits 19-1 to 19-N can betransferred to the connection nodes 23-1 to 23-N. As described above, inthis another type of the page latch reading out operation, the data DATAlatched in the latch circuits 19-1 to 19-N can be transferred to theread out circuit 27.

[0097] In order to set the memory cell to be non-selected state, thereare some ways in accordance with a type of nonvolatile memory cell,which are grouped into two types whether the nonvolatile memory has aselect transistor or not.

[0098]FIG. 10a shows a general NOR type nonvolatile memory cell. The NORtype nonvolatile memory cell does not have a select transistor. In thistype of a nonvolatile memory cell, in order to set the memory cell MC tobe non-selected, it is necessary to set all of the word lines WL in thecell matrix 2 to be at a non-select voltage which is typically 0 V.Also, FIG. 10b shows a three-transistor type nonvolatile memory. Thethree-transistor type nonvolatile memory cell has a select transistorSTD connected to a bit line and a select transistor STS connected to asource line. In this type of a nonvolatile memory cell, in order to setthe memory cell MC to be non-selected, it is necessary to set all theselect transistors STD connected to the bit line or all the selecttransistors STS connected to the source line in the cell matrix 2, to benon-select voltage which is typically 0V.

[0099] With the memory cell MC being at non-selected state, even if thefirst transfer gates 13-1 to 13-N are ON state, the data stored in thememory cell MC is not transferred to the bit lines BL1 to BLN.

[0100] Next, an example of a control circuit to control the nonvolatilesemiconductor memory device of the first embodiment with operationsthereof, is now described. FIG. 11 shows a block diagram illustratingone example of the control circuit. FIG. 11 specifically shows a blockdiagram of a control circuit to control from the data loading operationto the data programming operation.

[0101] Normal Operation.

[0102]FIG. 12 and FIG. 13 show waveform diagrams at normal operation ofthe control circuit illustrated in FIG. 11 respectively. FIG. 2 and FIG.3 are originally one waveform diagram, which is divided into twowaveform diagrams. Therefore, times t1, t2, illustrated in FIG. 12correspond with times t1, t2, illustrated in FIG. 13, respectively.

[0103] As shown in FIG. 11, the control circuit 31 includes a data loadcontrol logic 33, a finish logic after data load 35, an erase controllogic 37, a program control logic 39, a verify control logic 41, averify result judgment logic 43 and a recovery control logic 45.

[0104] The data load control logic 33 receives the chip enable signal/CE and the write enable signal /WE. When both of the chip enable signal/CE and the write enable signal /WE are set to Low level, a READY//BUSYsignal is set from High level to Low level (at time t1 in FIG. 12). TheREADY//BUSY signal is a signal that indicates whether the nonvolatilesemiconductor memory device is a ready state or a busy state. When theREADY//BUSY signal is at High level, the READY//BUSY signal indicatesthe ready state. When the READY//BUSY signal is at Low level, theREADY//BUSY signal indicates the busy state.

[0105] The data load control logic 33 outputs DATA LOAD 1 to DATA LOAD Nsignals when both of the chip enable signal /CE and the write enablesignal /WE are set to Low level. Each of the DATA LOAD 1 to DATA LOAD Nsignals is a signal to control timings of N times of data loading. TheDATA LOAD1 to DATA LOADN signals are typically set from Low level toHigh level in numerical order (during the time period between t1 and t2in FIG. 12 (DATA LOAD)). When all of the DATA LOAD1 to DATA LOADN areset from High level to Low level, the data load logic 33 outputs a DATALOAD END signal which is a signal that indicates an end of the dataloading operation and is inputted to the finish logic after data load35.

[0106] The finish logic after data load 35 outputs the ERASE STARTsignal which is at High level when the a DATA LOAD END signal is set toHigh level and the TEST signal is set to Low level. The TEST signal isset to Low level at the normal operation. The ERASE START signal isinputted to the erase control logic 37.

[0107] The erase control logic 37 outputs an ERASE 1 to ERASE N′ signalswhen the ERASE START signal is set to High level. Each of the ERASE 1 toERASE N′ signals is a signal to control timings of the N′ times of dataerasing. The ERASE 1 to ERASE N′ are typically set from Low level toHigh level in numerical order (during the time period between t3 and t4in FIG. 12 (ERASE)). When all of the ERASE 1 to ERASE N′ signals are setfrom High level to Low level, the erase control logic 37 outputs a ERASEEND signal which is a signal that indicates an end of the erasingoperation and is inputted to an OR logic gate 38.

[0108] The OR logic gate 38 outputs a PROGRAM START signal which is Highlevel when one of an ERASE END signal and a REPROGRAM START signal isset to High level. The PROGRAM START signal is a signal which indicatesa start of the programming operation and is inputted to the programcontrol logic 39.

[0109] The program control logic 39 outputs PROGRAM 1 to PROGRAM N″signals when the PROGRAMS START signal is set to High level. Each of thePROGRAM 1 to PROGRAM N″ signals indicates a signal to control timings ofN″ times of data programming. The PROGRAM 1 to PROGRAM N″ signals aretypically set from Low level to High level in numerical order (duringthe time period between t5 and t6 in FIG. 12 (PROGRAM)). When all of thePROGRAM 1 to PROGRAM N″ signals are set from High level to Low level,the program control logic 39 outputs a PROGRAM END signal which is asignal that indicates an end of the programming operation and isinputted to a verify control logic 41.

[0110] When the PROGRAM END signal is set to Low level, the verifycontrol logic 41 outputs VERIFY 1 to VERIFY N′″ signals. Each of theVERIFY 1 to VERIFY N′″ signals indicates a signal to control timings ofN′″ times of verifying. The VERIFY 1 to VERIFY N′″ signals are typicallyset from Low level to High level in numerical order (during the timeperiod between t7 and t8 in FIG. 13 (VERIFY)). When all of the VERIFY 1to VERIFY N′″ signals are set from High level to Low level, the verifycontrol logic 41 outputs a VERIFY END (I) signal which is a signal thatindicates an end of the verifying operation and is inputted to a verifyresult judgment logic 43.

[0111] When both of the VERIFY END (I) signal and a VERIFY PASS signalare set to High level, the verify result judgment logic 43 outputs theVERIFY END (I) of High level. When the VERIFY PASS signal is set to Lowlevel, the verify result judgment logic 43 outputs the PROGRAM STARTsignal of Low level. The PROGRAM START signal indicates a start of areprogramming operation and is inputted to the OR logic gate 38. When aREPROGRAM START signal is set to High level, the reprogrammingoperation, which is shown as REPROGRAM in FIG. 12, is carried out. Also,the VERIFY END (II) signal is a signal which indicates an end of theverifying operation at an normal operation and is inputted to the ORlogic gate 44.

[0112] The OR logic gate 44 outputs a RECOVERY START (I) signal of Highlevel, when one of the VERIFY END (II) signal and the RECOVERY START(II) signal is set to High level. The RECOVERY START (I) signal is asignal which indicates a start of a recovery operation and is inputtedto a recovery control logic 45.

[0113] When the RECOVERY START (I) signal is set to High level, therecovery control logic 45 outputs RECOVRY 1 to RECOVRY N″″ signals. Eachof the RECOVRY 1 to RECOVRY N″″ signals indicates a signal to controltimings of N″″ times of recovery. The RECOVRY 1 to RECOVRY N″″ signalsare typically set from Low level to High level in numerical order(during the time period between t9 and t10 in FIG. 13 (RECOVEY). Whenall of the RECOVRY 1 to RECOVRY N″″ signals are set from High level toLow level, the recovery control logic 45 outputs a RECOVERY END signalwhich is a signal that indicates an end of the recovery operation. Whenthe RECOVERY END signal is set from High level to Low level, aREADY//BUSY signal is set from Low level to High level. As a result, thesemiconductor memory device becomes in a halted condition (at a time t11in FIG. 13).

[0114] As stated above, the control circuit 31 makes the semiconductormemory device to carry out the data loading operation, the data erasingoperation, the data programming operation and the verifying operationautomatically at the normal operation. And after the verifyingoperation, the semiconductor memory device carries out the recoveryoperation, then is halted. The verifying operation can be omitted. Inthis case, after automatically carrying out the data loading operation,the data erasing operation and the data programming operation, thesemiconductor memory device carries out the recovery operation and then,becomes in a halted condition.

[0115] Testing Operation.

[0116]FIG. 14 shows waveform diagram, which indicates a testingoperation of the control circuit 31, illustrated in FIG. 11. A timeperiod between a time t1 and a time t2 in FIG. 14 indicates a period ofa data loading operation. Similar to the normal operation, after thedata loading operation, the DATA END signal is set to High level. Thelogic after data load 35 outputs the RECOVERY START (II) of High level,when the DATA LOAD END signal and a TEST signal are set to High level.The TEST signal is set to High level during the testing operation. TheRECOVRY START (II) signal is inputted to the OR logic gate 44. Also, theERASE START signal remains at Low level.

[0117] The OR logic gate 44 outputs a RECOVERY START (I) signal of Highlevel, when one of the VERIFY END (II) signal and the RECOVERY START(II) signal is set to High level. The RECOVERY START (I) signal isinputted to a recovery control logic 45. A recovery period between atime t3 and a time t4 in FIG. 14 is a time period while the recoveryoperation carried out similar to the normal operation. After therecovery operation is ended, the RECOVERY END signal is set to Highlevel then is set to Low level (RECOVERY END). The READY//BUSY signal isset from Low level to High level, and the semiconductor memory devicebecomes in a halted condition (at a time t5 in FIG. 14).

[0118] As stated above, at the testing operation, the control circuit 31carries out the recovery operation after the data loading operation isended, and makes the semiconductor memory device become in a haltedcondition.

[0119] A specific circuit schematic of the control circuit 31 is notlimited to a circuit schematic illustrated in FIG. 11, and any othercircuit configurations including a sequence as to be illustrated in FIG.15 may be used thereto.

[0120] Second Embodiment.

[0121]FIG. 16a and FIG. 16b show data flow diagrams at the data loadingoperation and the page latch reading out operation of a semiconductormemory device of the second embodiment respectively. The semiconductormemory device of the second embodiment differs from the semiconductormemory device of the first embodiment in that an error correction systemis provided.

[0122] First of all, the error correction system produces an inspectionbits from an original data. The inspection bits are produced by aninspection bit generating circuit 51. The inspection bits and theoriginal data are programmed to the corresponding memory cells at thesame time. Also, at the reading out operation, the original data and theinspection bits are read out from the memory cells at the same time tojudge whether there is an error or not. Data that was judged as an erroris corrected and outputted. The judgment of whether there is an error ornot, and the error correction if any are carried out at the errorcorrection circuit 53.

[0123] When a test and an inspection of the error correction system arecarried out, it is necessary that many suspected error correctionpatterns are inputted to confirm that the error patterns are correctedregularly. Conventionally, it has taken a long time to test and inspectdata by the error correction system because the data are programmed tomemory calls after data loading. Nevertheless, in the second embodimentof the present invention, as shown in FIG. 16a and FIG. 16b, at atesting operation, after the data loading operation is carried out, anoperation of the semiconductor memory device is once stopped. Afterthat, the page latch operation is carried out. This sequence is the sameas the operations of the first embodiment.

[0124] As a result, the data programming operation to the memory cellscan be omitted at the test and inspection operation by the errorcorrection system where it is necessary that many suspected errorpatterns are inputted. Therefore, in the second embodiment, a time forestimating and testing by the inspection bits generating circuit 51 andthe error correction circuit 53 can be shorter than the conventionalsemiconductor memory device.

[0125]FIG. 17a to FIG. 17c show data flows of the second embodiment ofthe nonvolatile semiconductor memory device at the normal operation. Asshown in FIG. 17a to FIG. 17c, the semiconductor memory device in thesecond embodiment operates similar to the conventional semiconductormemory device at the normal operation.

[0126] Exemplary applications employing the above-describedsemiconductor memory device are now described.

[0127] A memory card having the above mentioned semiconductor memorydevice is shown in FIG. 19. As shown in FIG. 19, the semiconductormemory device receives/outputs predetermined signals and data from/to anexternal device (not shown).

[0128] A signal line (DAT), a command line enable signal line (CLE), anaddress line enable signal line (ALE) and ready/busy signal line (R/B)are connected to the memory card having the above mentionedsemiconductor memory device. The signal line (DAT) transfers data,address or command signal. The command line enable signal line (CLE)transfers a signal which indicates that a command signal is transferredon the signal line (DAT). The address line enable signal line (ALE)transfers a signal which indicates that an address signal is transferredon the signal line (DAT). The ready/busy signal line (R/B) transfers asignal which indicates whether the memory device is ready or not.

[0129] Another example of a memory card is shown in FIG. 20. The memorycard shown in FIG. 20 differs from the memory card presented in FIG. 19in that the memory card includes a controller which controls thesemiconductor memory device and receives/transfers predetermined signalsfrom/to an external device (not shown).

[0130] The controller includes a interface unit (I/F), a micro processorunit (MPU), a buffer RAM and an error correction code unit (ECC). Theinterface unit (I/F) receives/outputs predetermined signals from/to anexternal device (not shown). The micro processor unit converts a logicaladdress into a physical address. The buffer RAM stores temporarily data.The error correction code unit generates an error code. And a commandsignal line (CMD), a clock signal line (CLK) and a signal line (DAT) areconnected to the memory card.

[0131] Although memory cards have been described as above, the number ofcontrol signal lines, the bit width of the signal line (DAT) and thecircuit construction of the controller may be modified while remainingwithin the scope of the invention.

[0132] Another application is shown in FIG. 21. A memory card holder towhich the memory card is inserted is shown in FIG. 21. And the cardholder is connected to electronic device (not shown). The card holdermay have a part of the function of the controller.

[0133] Still another application is shown in FIG. 22. As shown in FIG.22, the memory card or the card holder to which the memory card isinserted, is inserted to a connecting apparatus. The connectingapparatus is connected to a board via a connecting wire and an interfacecircuit. The board has a CPU (Central Processing Unit) and a bus.

[0134] Yet another application is shown in FIG. 23. As shown in FIG. 23,the memory card or the card holder into which the memory card isinserted, is inserted to a connecting apparatus. The connectingapparatus is connected to PC (Personal Computer) via connecting wire.

[0135] As explained above, with the present invention, it is possible toprovide a semiconductor memory device that is capable of being easy tospecify a cause of an error for the case where a reprogrammed data is anerror and operating tests of a page latch and a read out circuit atshort time.

[0136] Additional advantages and modifications will readily occur tothose skilled in the art. Therefore, the invention in its broaderaspects is not limited to the specific details and representativeembodiments shown and described herein. Accordingly, variousmodifications may be made without departing from the spirit or scope ofthe general inventive concept as defined by the appended claims andtheir equivalents.

What is claimed is:
 1. A semiconductor memory device having a data latchcircuit, the semiconductor memory device comprising: a plurality of bitlines to which a reprogrammable memory cell is connected; a data bus onwhich data is transferred; a latch connected to each of the plurality ofbit lines; a read out circuit connected to the data bus; and a datatransfer circuit group having an ability to directly transfer the dataloaded in the latch circuit, to the read out circuit without beingtransferred to the memory cell.
 2. The semiconductor memory device ofclaim 1, wherein the data transfer circuit group includes: a firstoperation mode to transfer a data loaded to the latch circuit, to thememory cell connected to the bit line; a second operation mode totransfer the data read out from the memory cell to the read out circuit;and a third operation mode to directly transfer the data loaded in thelatch circuit, to the read out circuit.
 3. The semiconductor memorydevice of claim 2, wherein: the third operation mode is performed duringa test of the semiconductor memory device.
 4. The semiconductor memorydevice of claim 2, wherein: the first and second operation modes areperformed during a normal operation; and the third operation mode isperformed during a test of the semiconductor memory device.
 5. Thesemiconductor memory device of claim 1, wherein the data transfercircuit group includes: a first transfer gate, one end of which iselectrically connected to the bit line; a second transfer gate, one endof which is electrically connected to an other end of the first transfergate; a third transfer gate, one end of which is electrically connectedto the one end of the first transfer gate and an other end of which iselectrically connected to the latch circuit; and a fourth transfer gate,one end of which is electrically connected to an other end of the secondtransfer gate and an other end of which is electrically connected to theread out circuit.
 6. The semiconductor memory device of claim 5,wherein: when data loaded to the latch circuit is transferred to thememory cell, the first transfer gate is set to an ON state, the secondtransfer gate is set to an OFF state, the third transfer gate is set toan ON state, the fourth transfer gate is set to an OFF state; when thedata read out from the memory cell is transferred to the read outcircuit, the first transfer gate is set to an ON state, the secondtransfer gate is set to an ON state, the third transfer gate is set toan OFF state, the fourth transfer gate is set to an ON state; when thedata loaded to the latch circuit is directly transferred to the read outcircuit not via the memory cell, the first transfer gate is set to anOFF state, the second transfer gate is set to an ON state, the thirdtransfer gate is set to an ON state, the fourth transfer gate is set toan ON state.
 7. The semiconductor memory device of claim 6, wherein: apotential of the control electrode of the third transfer gate isgradually raised to an ON state.
 8. The semiconductor memory device ofclaim 5, wherein: when the data loaded to the latch circuit istransferred to the memory cell, the first transfer gate is set to an ONstate, the second transfer gate is set to an OFF state, the thirdtransfer gate is set to an ON state, the fourth transfer gate is set toan OFF state; when the data read out from the memory cell is transferredto the read out circuit, the first transfer gate is set to an ON state,the second transfer gate is set to an ON state, the third transfer gateis set to an OFF state, the fourth transfer gate is set to an ON state;when the data loaded to the latch circuit is transferred to the read outcircuit, the first to the fourth transfer gates are set to an ON state,and the memory cell is set to a non-selected state.
 9. The semiconductormemory device of claim 8, wherein: a potential of the control electrodeof the third transfer gate is gradually raised to an ON state.
 10. Thesemiconductor memory device of claim 1, further comprising: a controlcircuit configured to control the transfer gate group so as to achieve afirst operation mode and a second operation mode, wherein: the firstoperation mode involves programming data loaded to the latch circuit tothe memory cell; and the second operation mode involves stopping anoperation after data is loaded to the latch circuit.
 11. Thesemiconductor memory device of claim 10, wherein: the first operationmode is performed in a normal operation; and the second operation modeis performed in a testing operation.
 12. The semiconductor memory deviceof claim 1, further comprising: an error correction circuit that iselectrically connected to the read out circuit.
 13. A semiconductormemory device having a data latch circuit, the semiconductor memorydevice comprising: a plurality of bit lines to which a reprogrammablememory cell is connected; a data bus on which data is transferred; alatch circuit configured to latch the data transferred on the data bus;a read out circuit connected to the data bus; and a data transfercircuit group; wherein the data transfer circuit group is controlled soas to transfer the data latched in the latch circuit to the read outcircuit without being transferred to the memory cell.
 14. Thesemiconductor memory device of claim 13, wherein the data transfercircuit has: a first operation mode to transfer data loaded to the latchcircuit to the memory cell connected to the bit line; a second operationmode to transfer data read out from the memory cell to the read circuit;and a third operation mode to directly transfer the data latched in thelatch circuit to the read circuit.
 15. The semiconductor memory deviceof claim 14, wherein: the third operation mode is performed during atest of the semiconductor memory device.
 16. The semiconductor memorydevice of claim 14, wherein: the first and the second operation modesare performed during a normal operation; and the third operation mode isperformed during a test of the semiconductor memory device.
 17. Thesemiconductor memory device of claim 13, wherein the data transfercircuit group includes: a first transfer gate, one end of whichelectrically connected to the bit line; a second transfer gate, one endof which electrically connected to an other end of the first transfergate; a third transfer gate, one end of which electrically connected tothe one end of the first transfer gate and an other end of whichelectrically connected to the latch circuit; and a fourth transfer gate,one end of which electrically connected to an other end of the secondtransfer gate and an other end of which electrically connected to theread out circuit.
 18. The semiconductor memory device of claim 17,wherein: when data loaded in the latch circuit is transferred to thememory cell, the first transfer gate is set to an ON state, the secondtransfer gate is set to an OFF state, the third transfer gate is set toan ON state, the fourth transfer gate is set to an ON state; when dataread out from the memory cell is transferred to the read out circuit,the first transfer gate is set to an ON state, the second transfer gateis set to an ON state, the third transfer gate is set to an OFF state,and the fourth transfer gate is set to and ON state; when data loaded tothe latch circuit is directly transferred to the read out circuit notvia the memory cell, the first transfer gate is set to an OFF state, thesecond transfer gate is set to an ON state, the third transfer gate isset to an ON state, the fourth transfer gate is set to an ON state. 19.The semiconductor memory device of claim 18, wherein: a voltage of agate electrode of the third transfer gate is gradually raised to an ONstate.
 20. The semiconductor memory device of claim 17, wherein: whendata loaded to the latch circuit is transferred to the memory cell, thefirst transfer gate is set to an ON state, the second transfer gate isset to an OFF state, the third transfer gate is set to an ON state, andthe fourth transfer gate is set to an OFF state; when data read out fromthe memory cell is transferred to the read out circuit, the firsttransfer gate is set to an ON state, the second transfer gate is set toan ON state, the third transfer gate is set to an OFF state, and thefourth transfer gate is set to an ON state; when data loaded to thelatch circuit is transferred to the read out circuit, the first to thefourth transfer gates are set to an ON state, and the memory cell is setto a non-selected state.
 21. The semiconductor memory device of claim20, wherein: a voltage of a gate electrode of the third transfer gate isgradually raised to set to an ON state.
 22. The semiconductor memorydevice of claim 13, further comprising: a control circuit configured tocontrol the transfer gate group so as to achieve a first and secondoperation modes, wherein: the first operation mode involves programmingdata loaded to the latch circuit to the memory cell; and the secondoperation mode involves stopping an operation after data is loaded tothe latch circuit.
 23. The semiconductor memory device of claim 21,wherein: the first operation mode is performed in a normal operation;and the second operation mode is performed in a testing operation. 24.The semiconductor memory device of claim 13, further comprising: anerror correction circuit that is electrically connected to the read outcircuit.
 25. A test method of a semiconductor memory device, the methodcomprising: latching data in a page latch via a data bus on which thedata are transferred; and transferring the data latched in the pagelatch to a cell matrix for storing the data in a first mode and to aread-out circuit in a second mode for testing whether or not an erroroccurs in a data transfer circuit group including the data bus, the pagelatch and read out circuit.
 26. A memory card including thesemiconductor memory device of claim
 1. 27. A card holder into which thememory card of claim 26 is inserted.
 28. A connecting device into whichthe memory card of claim 26 is inserted.
 29. The connecting deviceaccording to claim 28, wherein: the connecting device is connected to acomputer.
 30. A memory card comprising: the semiconductor memory deviceof claim 1; and a controller that controls the semiconductor memorydevice.
 31. A card holder into which the memory card of claim 30 isinserted.
 32. A connecting device into which the memory card of claim 30is inserted.
 33. The connecting device according to the claim 32,wherein: the connecting device is connected to a computer.
 34. A memorycard including the semiconductor memory device of claim
 13. 35. A cardholder into which the memory card of claim 34 is inserted.
 36. Aconnecting device into which the memory card of claim 34 is inserted.37. The connecting device of claim 36, wherein: the connecting device isconnected to a computer.
 38. A memory card comprising: the semiconductormemory device of claim 13; and a controller that controls thesemiconductor memory device.
 39. A card holder into which the memorycard of claim 38 is inserted.
 40. A connecting device into which thememory card of claim 38 is inserted.
 41. The connecting device of claim40, wherein: the connecting device is connected to a computer.